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木(mu)材雕(diao)刻(ke)機報價(jia)，激光刻(ke)字機價(jia)格多少，木(mu)材激光雕(diao)刻(ke)機，木(mu)材激光切割機
木(mu)(mu)材雕刻機價(jia)格(ge)(ge)，木(mu)(mu)材激(ji)光刻字機價(jia)格(ge)(ge)多少，木(mu)(mu)材激(ji)光雕刻機廠家(jia)，木(mu)(mu)材激(ji)光切割(ge)機價(jia)格(ge)(ge)
小型(xing)激光(guang)刻字(zi)機價(jia)格，激光(guang)雕刻機價(jia)格，小型(xing)木材雕刻機，大型(xing)激光(guang)雕刻機
co2小(xiao)型激(ji)光刻字機(ji)價格，CO2激(ji)光雕(diao)(diao)刻機(ji)價格，小(xiao)型木材雕(diao)(diao)刻機(ji)價格，大型激(ji)光雕(diao)(diao)刻機(ji)價格
激(ji)光(guang)刻字設(she)備(bei)，co2激(ji)光(guang)刻字設(she)備(bei)，激(ji)光(guang)雕刻切割機價格
激光刻字(zi)設(she)備廠(chang)家，co2激光刻字(zi)設(she)備廠(chang)家，co2激光雕刻切割機價格
木(mu)材(cai)切(qie)割雕刻(ke)，木(mu)材(cai)激光切(qie)割雕刻(ke)，co2木(mu)材(cai)切(qie)割雕刻(ke)，木(mu)材(cai)co2激光切(qie)割雕刻(ke);
凹(ao)片(pian)雕(diao)(diao)刻(ke)，木(mu)質(zhi)凹(ao)片(pian)雕(diao)(diao)刻(ke)，木(mu)質(zhi)凹(ao)片(pian)雕(diao)(diao)刻(ke)機，co2木(mu)質(zhi)凹(ao)片(pian)雕(diao)(diao)刻(ke),木(mu)質(zhi)凹(ao)片(pian)激光雕(diao)(diao)刻(ke)
凸版(ban)(ban)雕(diao)刻，木質(zhi)凸版(ban)(ban)雕(diao)刻，木質(zhi)凸版(ban)(ban)雕(diao)刻機，co2木質(zhi)凸版(ban)(ban)雕(diao)刻，co2木質(zhi)凸版(ban)(ban)雕(diao)刻機；
玻(bo)(bo)璃(li)切割(ge)雕刻(ke)，玻(bo)(bo)璃(li)激(ji)光(guang)切割(ge)雕刻(ke)，玻(bo)(bo)璃(li)木(mu)材(cai)切割(ge)雕刻(ke)，玻(bo)(bo)璃(li)co2激(ji)光(guang)切割(ge)雕刻(ke);

木(mu)質激(ji)光雕(diao)刻機：

木材(cai)激光雕(diao)(diao)(diao)刻(ke)機一般用(yong)于木材(cai)加(jia)工的(de)(de)(de)切(qie)割(ge)和雕(diao)(diao)(diao)刻(ke)，木質(zhi)材(cai)料激光雕(diao)(diao)(diao)刻(ke)形(xing)式可分為切(qie)割(ge)雕(diao)(diao)(diao)刻(ke)、凹模雕(diao)(diao)(diao)刻(ke)和凸(tu)模雕(diao)(diao)(diao)刻(ke)三種。激光雕(diao)(diao)(diao)刻(ke)的(de)(de)(de)材(cai)料去除原理與激光切(qie)割(ge)相同，多條未(wei)切(qie)透的(de)(de)(de)切(qie)槽(cao)連在(zai)一起就(jiu)形(xing)成成面積(ji)的(de)(de)(de)材(cai)料去除。激光切(qie)槽(cao)的(de)(de)(de)橫截面呈“V”形(xing)，切(qie)割(ge)速(su)度(du)越低、激光電(dian)流越大(da)，切(qie)槽(cao)寬(kuan)度(du)和深度(du)也越大(da)，其中切(qie)割(ge)速(su)度(du)和激光電(dian)流對切(qie)槽(cao)深度(du)的(de)(de)(de)影響程度(du)比(bi)對切(qie)槽(cao)寬(kuan)度(du)大(da)得多。

木(mu)質材(cai)(cai)料(liao)激(ji)光雕刻加工(gong)(gong)的(de)(de)(de)基(ji)本原理(li)與(yu)(yu)激(ji)光切(qie)(qie)割(ge)加工(gong)(gong)基(ji)本相同(tong)，都是(shi)利用(yong)高能量密度(du)的(de)(de)(de)激(ji)光束轉化(hua)(hua)(hua)為熱能，瞬時引起木(mu)材(cai)(cai)熱分解和炭化(hua)(hua)(hua)，從(cong)而(er)去除(chu)部分材(cai)(cai)料(liao)。激(ji)光切(qie)(qie)割(ge)是(shi)將木(mu)質材(cai)(cai)料(liao)(主要(yao)是(shi)板材(cai)(cai))的(de)(de)(de)不同(tong)部分分離開，而(er)激(ji)光雕刻是(shi)在(zai)木(mu)質材(cai)(cai)料(liao)的(de)(de)(de)表面加工(gong)(gong)出要(yao)求的(de)(de)(de)圖 案、花紋和文字等(deng)。對同(tong)一(yi)(yi)木(mu)板講，激(ji)光切(qie)(qie)割(ge)所(suo)需(xu)(xu)的(de)(de)(de)能量較(jiao)大，而(er)激(ji)光雕刻由于(yu)不需(xu)(xu)要(yao)切(qie)(qie)透(tou)工(gong)(gong)件，故所(suo)需(xu)(xu)的(de)(de)(de)能量相對較(jiao)小。激(ji)光雕刻是(shi)非接(jie)觸式加工(gong)(gong)方法(fa)，與(yu)(yu)傳統機械(xie)加工(gong)(gong)方法(fa)相比具(ju)(ju)有無木(mu)屑污(wu)染(ran)、無刀具(ju)(ju)磨損也不需(xu)(xu)更(geng)換刀具(ju)(ju)、無噪(zao)聲(sheng)污(wu)染(ran)(噪(zao)聲(sheng)很低)等(deng)優點。激(ji)光切(qie)(qie)割(ge)頭聚焦透(tou)鏡(jing)將激(ji)光聚焦至(zhi)一(yi)(yi)個很小的(de)(de)(de)光斑(ban)，光斑(ban)直徑一(yi)(yi)般為0．1～0．5mm。激(ji)光束焦點位于(yu)待(dai)加工(gong)(gong)表面附近，用(yong)以(yi)熔(rong)化(hua)(hua)(hua)或汽(qi)化(hua)(hua)(hua)被(bei)加工(gong)(gong)材(cai)(cai)料(liao)。與(yu)(yu)此同(tong)時，與(yu)(yu)光束同(tong)軸(zhou)的(de)(de)(de)氣流由切(qie)(qie)割(ge)頭噴出，將熔(rong)化(hua)(hua)(hua)或汽(qi)化(hua)(hua)(hua)了的(de)(de)(de)材(cai)(cai)料(liao)由切(qie)(qie)口底部吹(chui)出。

技術優點：

金米蘭(lan)激光研發團隊從根本上解(jie)決(jue)因激光設備對(dui)各類(lei)木材料雕刻(ke)切割(ge)時(shi)出現(xian)的速(su)度慢、雕刻(ke)深度淺、切割(ge)邊鋸齒狀、邊線不光滑(hua)等缺(que)點(dian)。同時(shi)可(ke)以采用視覺定位等最新(xin)技術有(you)效(xiao)解(jie)決(jue)精密切割(ge)、高速(su)雕刻(ke)技術難(nan)題。

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Wood laser engraving machine:

Wood laser engraving machine is generally used for cutting and engraving of wood processing. The laser engraving form of wood material can be divided into three types: cutting engraving, concave engraving and punching engraving. The principle of material removal by laser engraving is the same as that of laser cutting. A plurality of uncut slots are joined together to form an area of material removal. The cross section of the laser grooving is "V". The lower the cutting speed, the larger the laser current, the larger the grooving width and depth. The cutting speed and laser current affect the grooving depth more than the grooving width. Much more.

The basic principle of laser engraving of wood materials is basically the same as that of laser cutting. They use high-energy density laser beams to convert into thermal energy, which instantaneously causes thermal decomposition and charring of wood to remove some materials. Laser cutting separates different parts of the wood material (mainly the board), while laser engraving processes the required patterns, patterns and text on the surface of the wood material. For the same board, the energy required for laser cutting is large, and laser engraving requires relatively little energy because it does not need to cut through the workpiece. Laser engraving is a non-contact processing method. Compared with traditional machining methods, it has the advantages of no wood chip contamination, no tool wear, no need to change tools, no noise pollution (low noise). The laser cutting head focusing lens focuses the laser to a small spot with a spot diameter of typically 0.1 to 0.5 mm. The focus of the laser beam is located near the surface to be machined to melt or vaporize the material being processed. At the same time, the airflow coaxial with the beam is ejected by the cutting head, and the melted or vaporized material is blown out from the bottom of the slit.

Technical advantages: